Sekisui s-lec b/k polyvinyl butyral resins

Sekisui Chemical leads the industry in the production of Polyvinyl Butyral and Polyvinyl Acetal resins.  Best known for interlayer film in safety glass used in automotive industry.  In addition to excellent adhesion to glass, PVB also adheres to substrates including plastic, metal, textile, wood, leather and ceramics.  PVB is utilized in a wide range of end uses including ceramic binders, printing inks, specialty lacquers and coatings, conductive inks, adhesives, carbon fiber/composites, treated polyolefins, and many others.  

Sekisui’s development of the S-LEC K Polyvinyl Acetal resins expand on the capabilities PVB by dramatically improving adhesion and thermal properties enabling S-LEC K to be used as a binder for printed circuit boards, conductive Inks, and other high heat inks and coatings applications.  

Polyvinyl butyral s-lec b/k key properties


  • Flexible, tough, excellent low temperature impact resistance
  • Excellent adhesion most substrates
  • Soluble in most organic solvents.  Soluble in alcohol.
  • Crosslinkable with melamines, phenolics, isocyanates, and epoxies. 
  • Excellent compatibility with other thermoplastic resins.  
  • Oderless, non toxic, water-white appearance.  FDA Clearances for direct food contact.
  • Excellent thermal resistance in Polyvinyl Acetals with softening points up to 300C
  • Binder for composites

End uses & applications


  • Temporary binder for ceramics, reflective sheet, and high heat baking processes
  • Printing Inks – Flexographic, Gravure, Conductive inks
  • Lacquers and coatings: wash primers, metal and foil coating, powder coating, vacuum metalizing paints, leather coatings
  • Adhesives- hot melts, wire coating, printed circuit boards 

 

 

Lubrizol adhesives solutions

From automotive and furnishing applications to textile bonding including methods for footwear and apparel construction, and a host of other applications, Lubrizol provides the highest quality thermoplastic polyurethane (TPU) solutions available.

Pearlbond and Pearlstick have become the industry standard for hot melt adhesives, reactive hot melts, and solvent based adhesives. These unique TPU resins offer process versatility and flexibility that distinguish them from standard polyurethane formulations.     

Pearlbond and Pearlstick offer  a wide range of functionality including high and low activation temperatures, solubility, levels of thermoplasticity, rates of crystallinity,  green strength, and crosslinkability.  Chemistries include polyester, polycaprolactone and polyether.   These resins will bond to most textile fabrics and substrates.

 

Request more information  

pearlbond hot melt adhesives


  • Pearlbond 300 series offers soft, plasticizer free, polyesters offer bondability to any substrate in the textile market.  Hardness range for 50-65 Shore A and possess excellent flexibility, freedom of movement, and soft touch.
  • Pearlbond 700 series is a family of fast crystalizing resins that offer fast setting bond, with good mechanical properties and low temperature flex.
  • Pearlbond360 is a soft polyether with excellent hydrolytic stability, moisture vapor transfer / breathability, with favorable solubility options.

 

pearlstick solution grade adhesives

  • Pearlstick resins are Linear thermoplastic polyurethane elastomers which have been specially developed for manufacture of solvent-based adhesives for the automotive, furniture, footwear, textile coatings, and other industries. 
  • Pearlstick utilizes crystalline polyol chemistries that provide outstandingly high tenacity and stress-strain power. 
  • Low melting point in their crystalline zones (50-60ÂșC) which can be softened or melted at relatively low temperatures for the adhesion process allowing sufficient thermoplasticity and surface tack to ensure correct alignment between substrates of different materials.
  • Polyol types include polyether, polyester and polycaprolactone
  • Unlike traditional aromatic TPU, Pearlstick is soluble in broad range of low viscosity solvent systems  allowing higher solids.